Electronics, Army STTR, Phase I
Efficient Red Micro-LEDs with Pixel Size < 5 Microns for Next-Generation Displays and Visible Light Communication Systems
Objective
Businesses must develop and demonstrate new micro-LED architectures that will lead to red micro-LEDs with high external quantum efficiency (>2%) when the pixel size is less than 5 microns.
Description
Due to their fast response, lightweight, low power consumption and high efficiency, micro-LEDs have received considerable attention in the development of next-generation displays and visible light communication systems for strategic and tactical battlefield applications for dismounted soldiers, as well as command and control systems.
Virtual Reality (VR) and Augmented Reality (AR) systems must have a high number of PPI (at least 4,000) since they emphasize the importance of small areas and high resolutions for battlefield visualization. To achieve the required miniaturization and high-resolution design, each micro-LED must be less than 5 microns in size.
Despite the reduction in LED chip size to below 10 microns, GaN-based blue and green micro-LEDs retain high performance in terms of external quantum efficiency. Most red micro-LEDs suffer from significant size-dependent efficiency droop due to serious surface recombination at the edges of the device. Existing red micro-LEDs shows EQE as low as 0.1% when their size is less than 5 microns, which represents a significant challenge for next-generation high-resolution AR/VR systems.
Scientific literature proposes many approaches, such as those based on InGaN-quantum wells and quantum dots enhanced structures, to address this problem with some success. However, many of these approaches are for chips with larger dimensions than what is required in this solicitation. Despite this, they indicate there are potential paths towards realizing high-efficient, red micro-LEDs.
As part of addressing this technology gap, innovations in material development and novel fabrication technologies, as well as significant improvements in existing materials and processes, are necessary to minimize and eliminate sidewall damage and the degradation of electrical injection. Scientific literature reports several strain engineering methodologies, especially those relating to the fabrication of multiple quantum well structures.
To achieve EQE greater than 2% for red micro-LEDs with a size between 2 and 5 microns, the Army seeks solutions. A new LED architecture should be compatible with RGB full color integration and be capable of accommodating large arrays. The Army does not need traditional technical approaches, including sidewall passivation using ALD or micro-LED pyramids.
Phase I
Businesses should develop a proof-of-concept solution for red micro-LEDs with pixel sizes of 2-5 microns and EQEs exceeding 2%. A detailed micro-LED architecture design and theoretical/numerical estimations of the EQE based on the pixel size must be included in the solution. Vendors need to ensure that they consider all aspects of the device fabrication, including a preliminary assessment of long-term, environmental stability and the justification behind the approach’s feasibility and practicality.
The Army designed Phase I to assess the technical merit, feasibility and commercial potential of a proposed effort. It also evaluates the performance prior to providing further support in Phase II. The deliverables should include a comprehensive final report, a presentation of the concept design, models, modeling data and results, model validation data, an optional demonstration of the proof of technology and plans for the continuation of Phase II work.
Phase II
Using the results of Phase I, the vendor must develop and demonstrate a prototype red micro-LED device that meets all of the requirements. The businesses should fabricate prototypes using standard cleanroom processes. The prototypes must integrate with the existing standard LED drivers for displays.
In addition, they should highlight the modularity of the system and prove the feasibility of large arrays during operational demonstrations. Businesses must conduct accelerated aging tests to determine the lifetime reliability and performance characteristics of the devices in storage and operation.
The deliverables must also include a detailed final report comprising a comprehensive assemblage of design documents, fabrication methods, experimental protocols, and prototype testing data and results. In addition, the business must deliver a full-scale prototype system with associated documentation to the government point of contact for independent testing and evaluation at a government laboratory.
Phase III
Based on the prototypes developed in Phase II, continued development must lead to productization of miniaturized red micro-LEDs for optical systems. Vendors should conduct testing on a variety of military platforms and develop a process for a large-scale production to support potential transition partners. This includes the Army and other Department of Defense agencies.
While the technology is primarily geared toward military and strategic applications, many other optical circuit applications, including in telecom industry hardware, can benefit from miniaturized red micro-LEDs. The sources that can operate over a very wide range of environmental conditions are likely to bring value to many existing commercial applications. Technologies meeting the needs of this topic may bring AR/VR systems toward a price point that could make them more attractive to the commercial markets.
Submission Information
All eligible businesses must submit proposals by noon ET.
To view full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
STTR Help Desk: usarmy.rtp.devcom-arl.mbx.sttr-pmo@army.mil
References:
- “Laser Lift-off Mechanism and Optical-electric Characteristics of Red Micro-LED Devices,” Opt. Express, 31, pp. 7887-7899 (2023).
- “An Ultrahigh Efficiency Excitonic Micro-LED,” Nano Lett. 23, PP. 1680–1687 (2023).
- “InGaN-based Red Light-emitting Diodes: From Traditional to Micro-LEDs,” Jpn. J. Appl. Phys. 61 SA0809 (2022).
- “2000 PPI Silicon-based AlGaInP Red Micro-LED Arrays Fabricated via Wafer Bonding and Epilayer Lift-off,” Optics Express, 29, pp. 20217-20228 (2021).
- “Fabrication and Study on Red Light Micro-LED Displays,” IEEE J. Electron Devices Soc., 6, pp. 1064-1069 (2018).
- “Enhanced Efficiency InGaN/GaN Multiple Quantum Well Structures via Strain Engineering and Ultrathin Subwells Formed by V-Pit Sidewalls,” ACS Appl. Opt. Mater. 2, pp. 220-229 (2024).
- “The Size-Dependent Photonic Characteristics of Colloidal-Quantum-Dot-Enhanced Micro-LEDs,” Micromachines, 14, (2023).
- “Improvement of 0ptical Properties of InGaN-based Red Multiple Quantum Wells,” Optics Express, 31, pp. 18567-18575 (2023).
- Micro-LEDs, Full-color display, Display devices, RGB displays, Light emitting diodes, Optoelectronic devices, Virtual reality, Augmented reality, External quantum efficiency.
Objective
Businesses must develop and demonstrate new micro-LED architectures that will lead to red micro-LEDs with high external quantum efficiency (>2%) when the pixel size is less than 5 microns.
Description
Due to their fast response, lightweight, low power consumption and high efficiency, micro-LEDs have received considerable attention in the development of next-generation displays and visible light communication systems for strategic and tactical battlefield applications for dismounted soldiers, as well as command and control systems.
Virtual Reality (VR) and Augmented Reality (AR) systems must have a high number of PPI (at least 4,000) since they emphasize the importance of small areas and high resolutions for battlefield visualization. To achieve the required miniaturization and high-resolution design, each micro-LED must be less than 5 microns in size.
Despite the reduction in LED chip size to below 10 microns, GaN-based blue and green micro-LEDs retain high performance in terms of external quantum efficiency. Most red micro-LEDs suffer from significant size-dependent efficiency droop due to serious surface recombination at the edges of the device. Existing red micro-LEDs shows EQE as low as 0.1% when their size is less than 5 microns, which represents a significant challenge for next-generation high-resolution AR/VR systems.
Scientific literature proposes many approaches, such as those based on InGaN-quantum wells and quantum dots enhanced structures, to address this problem with some success. However, many of these approaches are for chips with larger dimensions than what is required in this solicitation. Despite this, they indicate there are potential paths towards realizing high-efficient, red micro-LEDs.
As part of addressing this technology gap, innovations in material development and novel fabrication technologies, as well as significant improvements in existing materials and processes, are necessary to minimize and eliminate sidewall damage and the degradation of electrical injection. Scientific literature reports several strain engineering methodologies, especially those relating to the fabrication of multiple quantum well structures.
To achieve EQE greater than 2% for red micro-LEDs with a size between 2 and 5 microns, the Army seeks solutions. A new LED architecture should be compatible with RGB full color integration and be capable of accommodating large arrays. The Army does not need traditional technical approaches, including sidewall passivation using ALD or micro-LED pyramids.
Phase I
Businesses should develop a proof-of-concept solution for red micro-LEDs with pixel sizes of 2-5 microns and EQEs exceeding 2%. A detailed micro-LED architecture design and theoretical/numerical estimations of the EQE based on the pixel size must be included in the solution. Vendors need to ensure that they consider all aspects of the device fabrication, including a preliminary assessment of long-term, environmental stability and the justification behind the approach’s feasibility and practicality.
The Army designed Phase I to assess the technical merit, feasibility and commercial potential of a proposed effort. It also evaluates the performance prior to providing further support in Phase II. The deliverables should include a comprehensive final report, a presentation of the concept design, models, modeling data and results, model validation data, an optional demonstration of the proof of technology and plans for the continuation of Phase II work.
Phase II
Using the results of Phase I, the vendor must develop and demonstrate a prototype red micro-LED device that meets all of the requirements. The businesses should fabricate prototypes using standard cleanroom processes. The prototypes must integrate with the existing standard LED drivers for displays.
In addition, they should highlight the modularity of the system and prove the feasibility of large arrays during operational demonstrations. Businesses must conduct accelerated aging tests to determine the lifetime reliability and performance characteristics of the devices in storage and operation.
The deliverables must also include a detailed final report comprising a comprehensive assemblage of design documents, fabrication methods, experimental protocols, and prototype testing data and results. In addition, the business must deliver a full-scale prototype system with associated documentation to the government point of contact for independent testing and evaluation at a government laboratory.
Phase III
Based on the prototypes developed in Phase II, continued development must lead to productization of miniaturized red micro-LEDs for optical systems. Vendors should conduct testing on a variety of military platforms and develop a process for a large-scale production to support potential transition partners. This includes the Army and other Department of Defense agencies.
While the technology is primarily geared toward military and strategic applications, many other optical circuit applications, including in telecom industry hardware, can benefit from miniaturized red micro-LEDs. The sources that can operate over a very wide range of environmental conditions are likely to bring value to many existing commercial applications. Technologies meeting the needs of this topic may bring AR/VR systems toward a price point that could make them more attractive to the commercial markets.
Submission Information
All eligible businesses must submit proposals by noon ET.
To view full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
STTR Help Desk: usarmy.rtp.devcom-arl.mbx.sttr-pmo@army.mil
References:
- “Laser Lift-off Mechanism and Optical-electric Characteristics of Red Micro-LED Devices,” Opt. Express, 31, pp. 7887-7899 (2023).
- “An Ultrahigh Efficiency Excitonic Micro-LED,” Nano Lett. 23, PP. 1680–1687 (2023).
- “InGaN-based Red Light-emitting Diodes: From Traditional to Micro-LEDs,” Jpn. J. Appl. Phys. 61 SA0809 (2022).
- “2000 PPI Silicon-based AlGaInP Red Micro-LED Arrays Fabricated via Wafer Bonding and Epilayer Lift-off,” Optics Express, 29, pp. 20217-20228 (2021).
- “Fabrication and Study on Red Light Micro-LED Displays,” IEEE J. Electron Devices Soc., 6, pp. 1064-1069 (2018).
- “Enhanced Efficiency InGaN/GaN Multiple Quantum Well Structures via Strain Engineering and Ultrathin Subwells Formed by V-Pit Sidewalls,” ACS Appl. Opt. Mater. 2, pp. 220-229 (2024).
- “The Size-Dependent Photonic Characteristics of Colloidal-Quantum-Dot-Enhanced Micro-LEDs,” Micromachines, 14, (2023).
- “Improvement of 0ptical Properties of InGaN-based Red Multiple Quantum Wells,” Optics Express, 31, pp. 18567-18575 (2023).
- Micro-LEDs, Full-color display, Display devices, RGB displays, Light emitting diodes, Optoelectronic devices, Virtual reality, Augmented reality, External quantum efficiency.